Solutions across the spectrum of depaneling technology

The industry is digitizing, automating and there is increasing miniaturization. In the PCB world, more and more is becoming possible with smaller components. The use of highly sensitive components and the increasing quality requirements for printed circuit boards mean that manufacturers of electronic modules and PCB boards are constantly facing new challenges. In turn, they also place more demands on depaneling technology. SCHUNK offers an answer to this.

SCHUNK's flexible standalone depaneling machines bet on precision, speed and process stability for the entire spectrum of customer requirements. Machining is done with turning or milling - with low stress, efficiently and without damaging the components, in contrast to conventional processes. SCHUNK thereby has two concepts in its range: universal depaneling machines on the one hand and fully automatic depaneling machines on the other. Universal depaneling machines (SAR series) are suitable for manual loading and unloading for small and large batches with medium to high product variation. The fully automatic variant (ILR series) is suitable for large batches and low product variation. Think short cycle times, high positioning accuracy and a palletizing option.

Universal variant

SAR-1300 is an example of the universal variant. It is predestined for small to large batch sizes with medium to large product variety. The design of the SAR-1300 incorporates a variety of suggestions and requirements from the market. The most outstanding feature of the SAR-1300 is its fast and modular depaneling capability. The extensive modular design allows the machine to be equipped with milling and turning modules and there is the possibility of inserting panels with one or two pendulum axes, depending on the output required. Various accessories and options are also possible, such as a camera system, database connection or magnetic workpiece holders. They enable cost-optimized future adaptation of the machine at any time.

Fully automatic variant

ILR-1800-B and ILR-2200-B - with optional palletizing system PAL-1500 - are fully automatic depaneling machines. They are designed for high flexibility and throughput. High throughput is achieved with the specially designed fast-acting PCB infeed for the ILR-2200-B and the use of dynamic actuators with continuous path control for disconnecting and handling PCBs. The simple and lightweight design of the PCB grippers minimizes tooling costs and, together with a gripper changeover system, ensures high flexibility and minimum setup time.

Laser technology

Finally, in terms of depaneling technology, SCHUNK still has the Stand Alone Laser (SAL-1300 series) in its product range. This machine with speedLAS® technology enables precision laser cutting at high speed through the interplay of linear axis technology and laser scan control. The laser reduces process times while ensuring optimum cutting quality. Laser cutting with the right source and the ability to combine laser machining with milling technology on one machine creates a high degree of flexibility.

Operation

In speedLAS® technology, a special scanner controls the laser so that its movements overlap the movements of the axes. This method ensures that the laser is always perpendicular to the workpiece, resulting in precise and straight cuts. The use of this technology provides aesthetically pleasing cut quality, but also leads to an 80% higher processing speed compared to other laser applications. In addition, the energy input in the edge area is optimized, further increasing the efficiency and quality of the cutting process.

Wavelengths and materials

In laser machining, the emphasis is on matching the wavelength to the material being machined. The SAL allows the use of arbitrary wavelengths to select the best laser source for each material. The flexible scanner dimensions allow precise machining in different applications. SCHUNK thereby relies on process support, which is carried out in close cooperation with Dr. Bohrer Lasertec GmbH. Based on a thorough and precise material analysis, the best possible laser for the customer's requirements is selected. The material is separated using different laser sources, then analyzed with a suitable microscope (e.g., a raster electron microscope) and evaluated under optimal conditions. Different carbonization degrees and levels for separation can be offered.